Menu
TTM is pleased to announce the name change of its Wireless BU. Effective January 1, 2021, Wireless BU is now named RF & Specialty Components BU (RF&S) to better reflect the developing nature of this BU and TTM's intention to support our customers with broad based high performance engineered component solutions.
TTM Technologies Support
Skip Navigation LinksHome > Support > Engineering & Design Services
Print

Engineering & Design Services

Mistakes are expensive. Proof of design that evolves to an unsustainable full concept is disastrous. Our customers capitalize upon TTM's breadth of engineering experience across the product life cycle. Our integrated engineering teams work to provide a complete picture of your product, from the testing of your vision through dependable full-scale production. They are not experts on your product, you are. They are experts on printed circuit board manufacturing, making them an invaluable resource in your pursuit of innovative interconnect solutions.

Request Technical Support Request Technical Support

Engineering and Design Capabilities

Signal Integrity Assurance

  • Channel Simulation (Driver to Receiver)
    • HFSS
  • Signal Characterization
    • Sonnet
    • Polar
  • Power / Thermal Analysis
    • TASPCB (Iceboard)

PCB Design Layout

  • Schematic Capture
    • Orcad (Cadence)
    • DX Designer (Mentor)
  • Rigid PCB & Flex Circuit Layout
    • Allegro (Cadence)
    • Xpedition (Mentor)
    • Boardstation (Mentor)
    • Altium Designer

Electro-Mechanical Design

  • Mechanical Design
    • SolidWorks Premium (Dassault)
    • Creo (PTC)
  • Wiring Design & Interconnect
    • Solidworks Electrical
  • DFM & DFMA Optimization

Applications of Design Services

Conceptualization

  • Product Configuration & Definition
  • Interconnect Selection
  • Preliminary Design/Feasibility Analysis

New Design

  • Backplane/Midplanes
  • Flex & Rigid-Flex PWBs
  • Passive RF/Microwave PWBs
  • CCAs/Daughtercards
  • Chassis/Enclosures

Redesign/Value Engineering

  • Cost Reduction
  • DFM/DFT/DFMA Refinement
  • Reliability Improvement
  • Weight Reduction
  • Performance Enhancement

Standards Based Platforms

  • VME/VME64x
  • VITA 46 (VPX)
  • compactPCI
  • xTCA
  • ARINC 404/600
  • IEEE 1101.x
Signal Integrity Assurance

Signal Integrity Assurance


PCB Design Layout

PCB Design Layout


Electro Mechanical Design

Electro Mechanical Design


New Design

New Design


Redesign Value Engineering

Redesign Value Engineering


Standard Based Platforms

Standard Based Platforms


淘宝快3开奖结果 彩票网购最新公告 免费棋牌下载 新疆福彩18选7几点开奖 足彩胜负彩推荐分析预测 重庆幸运农场复式玩法 万人炸金花怎么玩 今天体育彩票31选7 白小姐一肖一马期期谁 888真人在线棋牌 查询福利彩票大奖 号码遗漏四川快乐12 2021排列五走势图 全民欢乐捕鱼OL详细信息 福彩中心游戏机 足球总进球数技巧预测 500万彩票四场进球彩