Menu
TTM is pleased to announce the name change of its Wireless BU. Effective January 1, 2021, Wireless BU is now named RF & Specialty Components BU (RF&S) to better reflect the developing nature of this BU and TTM's intention to support our customers with broad based high performance engineered component solutions.
TTM Products
Skip Navigation LinksHome > Products & Services > FLAT WRAP? Technology
Print

FLAT WRAP™ Technology

TTM's Engineering Teams has developed an innovative process: FLAT-WRAP™ Technology.

This patented technology eliminates the need for additional surface plated copper required to meet the IPC specification for wrap plating (ref. IPC 6012B Amendment 1 p. 3.6.2.11.1).

FLAT-WRAP™ Technology results in consistent wrap plate thickness matching the thickness of the initial surface foil.

FLAT-WRAP™ Technology is suited for design applications with multiple wrap plating requirements and fine pitch trace and space on plated layers, typically sequential lam jobs or standard thru hole Via-In-Pad requiring conductive or non-conductive via fill. Conventional processing methods to satisfy the wrap plating requirements limit the fabricator's capability for producing high-density surface features. Fine pitch trace and space limitations are magnified in designs requiring multiple wrap plating or sequential lamination steps. Efforts to maintain minimum wrap plating thicknesses in PCBs manufactured with conventional wrap plating often lead to design compromises and/or deviations.

TTM FLAT-WRAP™ Technology provides the following benefits:

  • Increased reliability due to wrap plate uniformity over the entire panel surface
  • Elimination of copper thickness build-up during multiple wrap plating cycles on a common layer
  • Improved surface plating distribution provides consistent impedance values on the plated layers with via-filled holes
  • Improved dielectric thickness on all sub-laminations between the sub-outer plated layer and the subsequent laminated layer
  • Reduced surface copper thickness enables designs with fine lines and tighter geometries
  • Improved soldermask thickness uniformity due to reduced copper feature height

FLAT-WRAP™ On

  • TTM FLAT-WRAP™ Technology (3x wrap on a common layer after 6x thermal stress)

FLAT-WRAP™ Off

  • Conventional Wrap Plating (3x wrap on a common layer after 6x thermal stress)

FLAT WRAP

FLAT WRAP™

淘宝快3开奖结果 极速快3开奖结果 新西兰分分彩开奖记录 广东快乐十分精确公式 排球比分显示器简要 欢乐腾讯麻将怎么建房 重庆时时彩禁售了 极速时时彩预测 北京赛车pk拾开奖直播扑克开奖结果 江西麻将机遥控器 mg视讯怎么玩 十一运夺金走势图遗漏 qq欢乐麻将手机版 ds视讯能赌吗 浙江体彩20选5开奖号码走势图 澳洲幸运10开奖信息 塑料期货行情