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TTM is pleased to announce the name change of its Wireless BU. Effective January 1, 2021, Wireless BU is now named RF & Specialty Components BU (RF&S) to better reflect the developing nature of this BU and TTM's intention to support our customers with broad based high performance engineered component solutions.
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Assembly & System Integration

TTM offers a one-stop solution leveraging our world class capabilities in manufacturing of complex PCB's and backplane assemblies through full system integration and testing. With real emphasis on bringing world class solutions to our customers in key markets such as Communications, Military and Aerospace, Automotive and Industrial and Medical.

TTM's ability to leverage our world class PCB, backplane and metal capabilities in lower cost regions allows us to deliver best in class "all under one roof" model solutions to our customers. These wide ranging capabilities allow TTM to deliver world class solutions that benefits the customer's quality, delivery and total cost of acquisition. In addition to a variety of capabilities ranging from level 1 to level 5 integration, TTM also has expertise in many specialized assemblies (including flex and rigid-flex).

Backplane & System Integration

Integrated Assembly

Backplanes

  • Press-fit (Compliant - pin)
  • Military QPL (MIL-28870)
  • Compression Mount
  • Surface Mount
  • Wave / Selective Solder
  • Up to 48" x 36"
  • Up to 0.450"+ PCB Thick
  • AOI of Connectors / Pins
  • X-Ray Inspection
  • Level 2/3 Testing (to 44k test points)
  • In Circuit (Level 4)
Backplanes

System Integration

  • Back Panel Assembly and Test
  • Card Cages, Racks and Chassis
  • Cooling and Power Distribution
  • Copper and Fiber Optic Cabling
  • Full Cabinet Assembly
  • System Design, Simulation and Modeling
  • PCBA Assembly and Test
  • Commercial and Military Qualifications
  • Global Manufacturing
Standards Based

Standards Based

  • VME / VME64x
  • VITA41© (VXS)
  • VITA46© (VPX)
  • CompactPCI™
  • microTCA™

Custom & Specialty Product

Rigid-Flex

Rigid-flex

  • Press-Fit, SMT & Thru-Hole Assembly
  • MIL-Spec, Types 1,2,3,4
  • Up to 36" x 24"
  • Heavy Copper (High Current Configs.)
  • Passive/Active Comps.
  • Integration w/ Rigid PCBs
  • AOI Inspection
  • X-Ray Inspection
  • Level 2/3 Testing (to 44k test points)
  • Design Services
RF/Microwave

RFMicrowave

  • 1-Piece Hermetic SMP / SMPM
  • Blind Solder Interconnect
  • Up to 36" x 24" PCBs via Automated Assembly
  • X-Ray Testing
  • RF Testing
Accessories

Accessories

  • Slot Adapters
  • Filter Panels
  • Air Impedance Module
  • IPMI Fan Controller
Custom Sub-System Assembly

Custom Sub-System  Assembly

  • Card-Cage thru Cabinet
  • Backplanes / Midplanes
  • Sheet metal / Machined Components
  • Peripheral PCBAs
  • Fan Trays
  • Harnessing / Cabling
  • Power Supplies
  • Functional Test
  • Design Services

MicroTCA™

Chassis Assembly

Chassis Assemblies

Single-Width
  • 4U, 5U, 6U Double-Width
  • 6U, 7U, 8U, 9U Triple/Quad-Width
  • 10U, 11U, 12U Ruggedized
  • ARINC 404 / 600 Flexible Options
  • Flush / Recessed
  • Fan-Tray / Cooling
  • Air Filtering
  • Finish / Graphics
Backplanes

Backplanes
Dual-Star
Single-Star
Flexible Options

  • Up to 12AMCs
  • 1 or 2 PSU slots
  • 1 or 2 MCH slots
  • JTAG (JSM) Slot
  • Telco Alarm Slot
  • Zone 3 Interconnect
  • Slot Pitch
  • RoHS 5/6 or 6/6
Accessories

Accessories

  • Slot Adapters
  • Filter Panels
  • Air Impedance Module
  • IPMI Fan Controller
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